Pretreatment Chemicals

RESIN BLEED & TAPE RESIDUE REMOVAL

ELECTROLYTIC DEFLASHING CHEMICAL

Electrodeflash EDF-28​

> Effective in removing mold flashes and resin bleed
> Using electrolytic process
> Suitable for high speed and short time process demand
> Water based formulation and environment friendly
> Premix and ready to use

IMMERSION DEFLASHING CHEMICAL

Deflashing Chemical, DF-10

> Non - toxic process for soften and loosening of mold flashes and resin bleed.
> Non - flammable solution.
> Will not attack the mold compound

Low Temperature Deflashing Chemical, DF-113

> Specially formulated to operate in low temperature.
> Non- toxic process for soften and loosening of mold flashes and resin bleed.
> Non – flammable solution.
> Will not attack the mold compound.

Tape Residue Removal, SCM 300

> Specially formulated to remove adhesive layer from QFN leadframes tape.
> Suitable for different Copper Alloys or Nickel Alloys.
> Ideal for use on sensitive surfaces and it will not attack the mold compound.
> SCM 300 is non - flammable and non - toxic solution.

Electrolytic Cleaner E-Clean 20

> Heavy duty cleaning for all types of metals substrate surface.
> Suitable for anodic or cathodic operations.
> Effective in removal of oils and stains on substrate surface.
> Water based formulation and environment friendly.
> Premix and ready to use.

DEGREASER FOR OIL & STAINS

METAL SURFACE POLISHER & BRIGHTENER

Copper Electropolisher E-Cu 30

> Anodic polishing of Copper / Copper Alloys for a bright surface finish.
> Designed to reduce surface roughness and remove surface burr.
> Low foaming and operational in wide-ranged current densities.
> Long bath life and ready to use.
> Fast process time at 5 seconds to 15 seconds only.

High Speed Copper Activator Cu ACT

> Formulated for descaling and surface activation of copper surface leadframes.
> Function to remove thick smut or black oxide layer prior to nickel or tin plating.
> Prevents defective plating finish or peeling issues.
> Suitable for all different types of copper alloys.
> Fast and high speed total activation

Copper Etchant CE Powder

> To clean and activate copper substrate surface.
> No formation of smut or black oxides after activation.
> Long lasting strength of solution.
> Suitable for high speed and short time process demand.
> Available in powder form.

HS Nickel Activator, NAC 98

> Specially formulated for cleaning and activating nickel surface.
> Performing well in removing oxide and activate nickel plated leadframe.
> Can be use in electroless nickel deposition or electrolytic nickel deposition.

HS Alloy 42 Descaler, HS AL42

> Specially formulated for cleaning and activating Alloy 42 substrate.
> Performing well in removing oxide and activate Alloy 42 leadframe.
> A simple one step process only.

METAL SURFACE ACTIVATION

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