Rohm & Haas Chemicals

RONACLEAN ™ GP-300 LF is an alkaline soak or electrolytic cleaner.
Designed for primary cleaning of most metals with or without the use of organic solvent degreasing.
RONACLEAN ™ GP-300 LF is low foaming and is satisfactory as a simple immersion cleaner.
For better result, electrolytic process is recommended.

RONOVEL ™ CM and AUROSPEED ™ CM Cobalt – Alloyed Electrolytic Gold products utilize a unique chelate system.
It able to prevents the oxidation of cobalt and substantially reduces the variation in cobalt co-deposition with respect to current density.
It is designes for low – and high – speed plating applications.
Suitable to use in all types of machines eg: reel-to-reel connector, stripe or strip-to-strip, automatic printed circuit tab, deep tank circuit and barrel plating.
A highly-even thickness distribution across the plated parts are easily can achived.

COPPER GLEAM™ PPR-H is a process specifically designed for copper plating of printed circuit boards with Pulse Periodic Reverse current plating at specific horizontal equipments.
The combination of COPPER GLEAM PPR-H Acid Copper with suitable Pulse Periodic Reverse rectification offers dramatic improvement in deposit thickness distribution on the surface and in the hole without compromising productivity, or the need for low current density plating.
COPPER GLEAM PPR-H System is stable under the condition of use and produces deposits capable of meeting the requirements of Mil-P-551100-E and BS9760.
Improves throwing power and surface thickness distribution.
Produces even, semi-bright deposits from stable solution.
Increased productivity due to high current density capability in the horizontal mode.
Reduced soldermask and copper usage due to improved surface thickness distribution.

Solder Strip 3880 is specifically formulated for the rapid removal of tin or tin-lead alloy on stainless steel belt in te semiconductor industry.
Solder Strip 3880 is a one – step process designes for using in M-to-M machines.
It produces low sludge , low fumes and no smell during operation.
It has superior holding capacity up to 200 g/L of dissolved solder.

Solder Strip SM is a non-peroxide , non-fluoride process designed for the fast stripping of tin (Sn) or tin-lead (SnPb) from copper and its alloys.
Its stripping rate is ca. 7 micron per minutes and can be increased to a high 20 micron per minutes under vigorous agitation and temperature.
Solder Strip SM does not attack copper or leave any residue / white smut.
It is able to dissolve 100 g/L of total SnPb before it is exhausted.
Solder Strip SM is an excellent choice for use in printed circuit boards eg: edge tab stripping prior to gold plating, especially in high – speed linear tab plating machines.